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China UV Laser Marking Machine - FRZ-LMU from Top Suppliers and Factory for Precision Marking Solutions
Equipment Introduction
Equipment Introduction: (UV Laser Marking Machine)
International first-class quality UV laser marking machine, within reach! The material has a high absorption rate for 355nm ultraviolet light, therefore ultraviolet lasers have a wider range of material adaptability. The ultraviolet focused spot is extremely small, and the processing heat affected zone is minimal, making it more suitable for ultra-fine marking of various materials;
Adopting high-performance imported ultraviolet lasers, the laser beam quality is superior, bringing users almost perfect marking effects;
The option to use a rotating dual workstation worktable greatly reduces the cycle time, resulting in a doubling of customer value within the same unit of time;
Equipped with safety protective covers that meet international safety standards, the machine has passed CE certification. The machine can avoid personal injury caused by operators' mis-operation and minimize safety risks;
Under 5W (inclusive), an air-cooled system is used, which is easy to integrate and has a small size, making it particularly suitable for the flying industry.
Application areas
The Friends laser Semiconductor UV Laser Marking Machine is used for fine marking, cutting, and microfabrication of special materials. It is mainly used for precision marking, cutting and surface treatment of various materials such as glass, LCD screens, textiles, thin ceramics, semiconductor silicon wafers, IC grains, sapphire, polymer films, etc.
Technical parameters
| Equipment model | FRZ-LMU3 | FRZ-LMU5 | FRZ-LMU10 |
| Average output power | 3W | 5W | 10W |
| Wave length | 355mm | ||
| Beam quality | M2≤1.2 | ||
| Power stability | ±3% | ||
| Maximum marking speed | 7000mm/s | ||
| Repetitive frequency range | 1-200KHz | ||
| Marking area | 70mm*70mm、110mm*110mm、175mm*175mm（optional） | ||
| Mini character height | 0.06mm | ||
| Mini line width | 0.01mm | ||
| Environment temperature | 10°C-35°C | ||
| Power supply | AC 220V/50HZ | ||
| power consumption | Less than 1.5 KW | ||
| Weight | Around 200kg | ||
| Cooling mode | Air cooling | Air cooling | Water cooling |
| Shields | Optional | ||
| Double station | Optional | ||
| Smoke purifier | Optional | ||
Equipment pictures
Samples pictures
Battery Charger Case
Glass Marking Time Code
Aluminum Alloy
Carbon Fiber
Medical Device Marking
Irregular Card Marking
Leather Marking, Drilling
Sound Film Cutting
Videos
Frequently Asked Questions
What materials can the UV laser marking machine mark?
The UV laser marking machine is highly versatile and suitable for fine marking, cutting, and microfabrication. It works on special materials including glass, LCD screens, textiles, thin ceramics, semiconductor silicon wafers, IC grains, sapphire, polymer films, and various plastics.
Why is 355nm UV laser technology preferred for precision marking?
Materials have a high absorption rate for 355nm ultraviolet light. The UV focused spot is extremely small, and the heat-affected zone during processing is minimal. This "cold processing" method prevents thermal deformation, making it ideal for ultra-fine marking.
What is the difference between the cooling modes of the models?
The 3W (FRZ-LMU3) and 5W (FRZ-LMU5) models utilize an integrated, compact air-cooling system, which is ideal for the flying marking industry. The 10W (FRZ-LMU10) model uses a water-cooling system to effectively manage the higher heat output and ensure stable performance.
How does the rotating dual workstation improve production efficiency?
The optional rotating dual workstation worktable allows the operator to load and unload materials on one station while the machine processes on the other. This significantly reduces cycle times and can double production efficiency within the same period.
What safety certifications and protection features does the machine have?
The machine is equipped with safety protective covers that meet international safety standards and has passed CE certification. This design protects operators from accidental exposure to the laser beam and minimizes operational risks.