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Femtosecond Laser Marking Machine - High Precision & Fast Processing from China Suppliers and Factory
Products Description
Femtosecond laser has the following three characteristics: firstly, the duration of femtosecond laser is extremely short, only a few femtoseconds, which is thousands of times shorter than the shortest pulse obtained by electronic methods, and is the shortest pulse that humans can obtain under experimental conditions. Secondly, femtosecond lasers have extremely high instantaneous power, reaching millions of gigawatts, which is hundreds of times more than the total power generation in the world. Once again, femtosecond lasers can focus into a spatial area smaller than the diameter of a hair, making the intensity of the electromagnetic field several times higher than the force exerted by the atomic nucleus on its surrounding electrons.
Due to the extremely high peak power of femtosecond laser, after focusing, its intensity can reach the order of 1022W/cm2. Such intensity far exceeds the Coulomb field of internal atomic interactions, so femtosecond laser pulses can easily release electrons from atomic bonds, form plasma, and easily cause material dissociation.
In the field of microfabrication, due to its minimal impact on the surrounding material, it can be safely cut, drilled, engraved, and even applied in the photolithography process of integrated circuits.
Application Areas
- Used for micro or invisible QR code marking;
- Stainless steel colorful marking;
- Stainless steel corrosion resistance marking, medical forceps marking, pacemaker marking, and medical device component marking;
- Fine marking and cutting of thin film materials;
- Ceramic marking drilling;
- Glass surface cleaning ink;
- Clean the coating.
Technical Parameters
| Equipment Model | FRZ-LMF-5F | FRZ-LMF-10F | FRZ-LMF-20F |
| Average output power(W) | 5W | 10w □ | 20W |
| Wave Length | 1064nm | ||
| Maximum sculpture speed | 7000mm/s | ||
| Pulse width | <400fs (can be customized) | ||
| Repetition frequency range | 1-1000KHz (can be customized) | ||
| Marking area | 110mm*110mm (Optional) | ||
| Min. character height | 0.03mm | ||
| Minimum line width | 0.03mm (depending on material) | ||
| Operation environmental temperature | 20°C-25°C (Suggest a constant temperature environment) | ||
| Power supply | AC220V/50Hz, 3KW | ||
| Cooling mode | Water cooling | ||
| Shields | Optional | ||
| Purifier | Optional | ||
Equipment Pictures
Samples Pictures
Stainless Steel Colorful Marking
Medical Pincers Marking
Pacemaker Marking
Videos
Frequently Asked Questions
What are the three main characteristics of a femtosecond laser?
A femtosecond laser features an extremely short duration (only a few femtoseconds), extremely high instantaneous power (millions of gigawatts), and the ability to focus into a spatial area smaller than a hair's diameter, creating intense electromagnetic fields that easily dissociate materials.
What are the primary application areas for this equipment?
It is widely used for micro/invisible QR code marking, stainless steel colorful and corrosion resistance marking, medical device component marking (such as forceps and pacemakers), thin film fine marking/cutting, ceramic drilling, glass surface ink cleaning, and coating removal.
What models are available for this femtosecond laser equipment?
The equipment is available in three models based on average output power: FRZ-LMF-5F (5W), FRZ-LMF-10F (10W), and FRZ-LMF-20F (20W).
What is the pulse width and wavelength of the laser?
The laser has a wavelength of 1064nm and a pulse width of less than 400fs, which can be further customized according to specific requirements.
What cooling mode and power supply does the machine require?
The equipment utilizes a water cooling mode and requires a power supply of AC220V/50Hz with a power capacity of 3KW.
Why is the femtosecond laser ideal for microfabrication?
Because of its minimal heat-affected zone and precise energy delivery, it causes minimal impact on surrounding materials, making it safe and highly effective for precision cutting, drilling, engraving, and photolithography.