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UV Laser Marking Machine FRZ-LMU – High-Quality Supplier and Factory in China for Ultra-Fine Marking Solutions
Equipment Introduction
Equipment Introduction: (UV Laser Marking Machine)
International first-class quality UV laser marking machine, within reach! The material has a high absorption rate for 355nm ultraviolet light, therefore ultraviolet lasers have a wider range of material adaptability. The ultraviolet focused spot is extremely small, and the processing heat affected zone is minimal, making it more suitable for ultra-fine marking of various materials;
Adopting high-performance imported ultraviolet lasers, the laser beam quality is superior, bringing users almost perfect marking effects;
The option to use a rotating dual workstation worktable greatly reduces the cycle time, resulting in a doubling of customer value within the same unit of time;
Equipped with safety protective covers that meet international safety standards, the machine has passed CE certification. The machine can avoid personal injury caused by operators' mis-operation and minimize safety risks;
Under 5W (inclusive), an air-cooled system is used, which is easy to integrate and has a small size, making it particularly suitable for the flying industry.
Application areas
The Friends laser Semiconductor UV Laser Marking Machine is used for fine marking, cutting, and microfabrication of special materials. It is mainly used for precision marking, cutting and surface treatment of various materials such as glass, LCD screens, textiles, thin ceramics, semiconductor silicon wafers, IC grains, sapphire, polymer films, etc.
Technical parameters
| Equipment model | FRZ-LMU3 | FRZ-LMU5 | FRZ-LMU10 |
| Average output power | 3W | 5W | 10W |
| Wave length | 355mm | ||
| Beam quality | M2≤1.2 | ||
| Power stability | ±3% | ||
| Maximum marking speed | 7000mm/s | ||
| Repetitive frequency range | 1-200KHz | ||
| Marking area | 70mm*70mm、110mm*110mm、175mm*175mm（optional） | ||
| Mini character height | 0.06mm | ||
| Mini line width | 0.01mm | ||
| Environment temperature | 10°C-35°C | ||
| Power supply | AC 220V/50HZ | ||
| power consumption | Less than 1.5 KW | ||
| Weight | Around 200kg | ||
| Cooling mode | Air cooling | Air cooling | Water cooling |
| Shields | Optional | ||
| Double station | Optional | ||
| Smoke purifier | Optional | ||
Equipment pictures
Samples pictures
Battery Charger Case
Glass Marking Time Code
Aluminum Alloy
Carbon Fiber
Medical Device Marking
Irregular Card Marking
Leather Marking, Drilling
Sound Film Cutting
Videos
Frequently Asked Questions
What materials can be marked with a UV Laser Marking Machine?
Our UV Laser Marking Machine is highly adaptable. It is designed for fine marking, cutting, and microfabrication on materials such as glass, LCD screens, textiles, thin ceramics, semiconductor silicon wafers, IC grains, sapphire, and polymer films.
Why is 355nm UV laser technology preferred for fine marking?
Materials have a very high absorption rate for 355nm ultraviolet light. Additionally, the ultraviolet focused spot is extremely small, resulting in a minimal heat-affected zone. This allows for ultra-fine cold marking without causing thermal damage to the surrounding material.
What is the cooling method used for different machine models?
Models under 5W (inclusive), such as the FRZ-LMU3 and FRZ-LMU5, utilize an integrated, space-saving air-cooling system. Higher-power models, like the 10W FRZ-LMU10, utilize a water-cooling system to ensure optimal thermal stability during continuous operation.
How does the rotating dual workstation improve efficiency?
The optional rotating dual workstation allows operator loading and unloading to happen simultaneously on one station while the laser marks materials on the other. This significantly reduces cycle times and doubles the production output.
What safety standards do these machines meet?
Our machines are equipped with safety protective covers that meet international safety standards and have passed CE certification, minimizing the risk of injury due to operator mis-operation.